Semiconductor manufacturing apparatus

ABSTRACT

A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.

FIELD OF THE INVENTION

The present invention relates to a processing apparatus having a networkto be interconnected with a storage device, and particularly relates toan inspection apparatus and a manufacturing apparatus for semiconductorsor semiconductor masks in relation to manufacture of semiconductors, anda system utilizing these inspection apparatus and the manufacturingapparatus.

BACKGROUND OF THE INVENTION

In order to interconnect interior devices of an apparatus or tointerconnect different apparatus, as a conventional construction,Japanese Laid-open Patent Application Nos. 2000-164667 and 2000-164666disclose to interconnect them through a standard LAN (local areanetwork), such as Ethernet (registered trademark).

As another known example, Japanese Laid-open Patent Application No.9-153441 divides a LAN into aplurality of segments and installs aprocessing station between the divided segments to copy data.

Japanese Laid-open Patent Application No. 11-85326 discloses a systemhaving a plurality of computers interconnected through a network, andall the design information is previously transferred from the client toa plurality of servers.

Further, Japanese Laid-open Patent Application No. 2002-132986 disclosesa system which interconnects clients and a manufacturing apparatus usingthe Internet.

An electron beam lithography apparatus is disclosed in JapaneseLaid-open Patent Application No. 63-208215, wherein a plurality ofelectron beam lithography systems are respectively connected with abuffer memory for storing writing data, and a control computer controlsthese plurality of buffer memories such that desired image data isstored in each buffer memory from the writing data storing unit, therebycontinuously writing different patterns within a writing area of eachelectron beam lithography system. Japanese laid-open Patent ApplicationNo. 7-307262 discloses an electron beam lithography apparatus whichdraws desired patterns by a charged electron beam with the aid ofapertures and the like based on CAD data as semiconductor designinformation.

As to conventional storage area networks, WO00/18049 and WO00/17769disclose a link through a fiber channel. WO00/29954 discloses a networkthrough an optical fiber. Also, a link through Ethernet (registeredtrademark), such as iSCSI, iFCP, and FCIP, and a link through a switchedbus or a shared bus are known. The storage area network is a generalterm of the network for linking storage devices without consideration ofa kind of communication device. The link of storage devices through aserial bus as defined in IEEE1394 and the link of storage devicesthrough a switched bus as defined by InfiniBand (registered trademark)are also included in the storage area network.

Mask layout data as a kind of semiconductor design information isprepared by a logic design maker. The mask layout data is then processedby the semiconductor design apparatus to provide a mask (reticle). Themask layout data is stored in a local storage device of the logic designmaker. If the logic design maker has to supply the mask layout data, forexample, to a mask shop which possesses a semiconductor manufacturingapparatus, the mask layout data should be copied in a storage mediumsuch as a magnetic tape. The mask shop then receives the storage mediumand copies the contents of the storage medium into a local storagedevice of the mask shop.

However, the aforementioned conventional technologies do not considerthe kind of data flowing through the network. Because two kinds of data,i.e. a large volume of CAD data representing design information ofsemiconductors and message data representing control commands forcontrolling and linking a variety of devices, are transferred throughthe same network, the traffic inevitably increases, degrading theperformance of the network, which in turn adversely affects the overallperformance of the system. In other words, the conventional networkshave a drawback in that the throughput of the network changes accordingto the frequency of issuing the control command, the frequency ofgenerating a response to the command, and the transmission/reception ofa large volume of data, thereby degrading the overall performance of theapparatus. As the advance of the micro-fabrication technology inparticular, the volume of the design data of semiconductors and masksand the volume of the image data as the inspection result drasticallyincrease. As a result, the band of the network is occupied by simplycommunicating these data. This adversely affects the transmission andreception of the message data.

As a prior art technology to solve this problem, all the designinformation is previously transferred to a plurality of computers forprocessing. However, because the volume of data transfer increases asthe number of computers linked, extreme amount of traffic occurs at timeof the data transfer. Further, each of the plurality of computers forreceiving the design information must provide a storage device forstoring a large volume of design information.

In this prior art technology, CAD data that is the basis of the designinformation of semiconductors is converted into a writing data formatoriginated from the electron beam lithography apparatus, and the patterndata indicated by this writing data format is further processed such asby conversion and correction in real time operation, thereby radiatingan electron beam. These processes are sequentially and continuouslyexecuted. Therefore, the conversion process and the correction processare carried out independently before executing the writing, and it isimpossible to temporarily store the processing results. As a result, itis very difficult to predict the time required for electron beamradiation and the accuracy of writing. Because processing results cannotbe stored in mid-course of the operation, it is very difficult tosuspend and restart the process. Even in the case of processing the samedesign data, the conversion process and the correction process must berepeated from the beginning.

In these prior art technologies, data is mostly stored in a file systemwhich realizes data having arbitrary length as assemblies of a pluralityof blocks having fixed length. This file system has a control listindicating the relation of a plurality of fixed length blocks associatedwith the arbitrary data. However, a large volume of fixed length blocksare required against such a large volume of data, which leads to a largevolume of the control list. This decreases an area in which the storagedevice actually stores data, and also adversely deteriorates thethroughput because of the retrieval process of the control list foraccessing the data. The fixed length blocks are ineffectively arrangedin the storage device as the result of preparation, deletion or transferof the data, which also deteriorates the throughput.

Of the above prior art technologies, a technique is suggested wherein aLAN is divided into a plurality of segments and processing stations areinstalled between the segments to perform copying of the data for thepurpose of alleviating the traffic. However, because the processingstations copy data between the segments, the processing stations per sebecome a bottleneck of the overall performance of the system. Further,because each of the storage devices interconnected to individualsegments copies the same data, the consistency management of the copieddata becomes complicated, which results in difficulty in systemoperation. For example, even if the semiconductor inspection apparatusand the semiconductor manufacturing apparatus are interconnected throughthe network, data must be copied through the network in order totransfer the data between these apparatus. This results in a crowd ofthe network and deteriorated throughput. Even in the case where aplurality of semiconductor inspection apparatus and a plurality ofsemiconductor manufacturing apparatus are interconnected through thenetwork and processing is carried out in a parallel manner, data must becopied through the network. This also results in a crowd of the networkand difficulty in the system organization due to management of dataexchange. Further, in most cases, it is impossible to interconnect a newstorage device through the network without stopping the operation of thesystem. In other words, when the storage device is filled up, it is verydifficult to extend the storage capacity.

SUMMARY OF THE INVENTION

In view of the above, the purpose of the present invention is to improvethe throughput of the entire apparatus and to unify the management ofvarious data.

According to the present invention, communication of control commandsand the like can be separated from a network, through which a largevolume of information such as semiconductor production information iscommunicated or through which a storage device is interconnected. Inother words, there is provided a network for communicating a largevolume of information and for interconnecting a storage device forstoring data.

Further, necessary processing results of at least one of a calculationunit, a control unit, and a writing unit are stored and referred to. Inother words, there is provided an interface to a network through whichthe storage device is interconnected at least with the calculation unit,the control unit, and the writing unit.

Further, a reference sequence to processing results that are stored inthe storage device corresponds to movement of the stage and a locus ofelectron beam radiation. In other words, writing area information andpattern information presented in the writing area information areprovided, and they are stored in a storage device in a manner conformingto the movement of the stage and the locus of the electron beamlithography.

Further, a storage device is not interconnected directly with aparticular computer. In other words, with the provision of a network forarbitrary interconnecting a computer and a storage device, a pluralityof computers share the storage device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram illustrating a basic configuration of asemiconductor manufacturing apparatus according to the presentinvention;

FIG. 2 is a block diagram illustrating one example employing a pluralityof computers according to the present invention;

FIG. 3 is a block diagram illustrating a parallel processingconfiguration of a calculation unit according to the present invention;

FIG. 4 is a flow chart by which areas shown in FIG. 3 are defined andprocessed;

FIG. 5 is a block diagram illustrating a configuration by which areainformation is divided and stored;

FIG. 6 is a flow chart by which the area information shown in FIG. 5 isdivided and processed;

FIG. 7 is a block diagram illustrating a configuration by which areainformation is divided and stored in another storage device;

FIG. 8 is a flow chart by which the area information shown in FIG. 7 isdivided and processed;

FIG. 9 is a block diagram illustrating a configuration by which areainformation is divided and stored in different storage devices;

FIG. 10 is a flow chart by which the area information shown in FIG. 9 isdivided and processed;

FIG. 11 shows an example in which design information is divided intostrip-shaped pieces;

FIG. 12 shows an example in which design information is divided intomesh-shaped pieces;

FIG. 13 shows an example in which a stripe writing information is storedas a pair of area information and pattern information included in thearea;

FIG. 14 shows an example in which stripe writing information is storedas a group of area information and a group of pattern information;

FIG. 15 shows an example in which a storage area network according tothe present invention is configured by a fabric;

FIG. 16 shows an example in which communication paths and communicationequipment are duplicated;

FIG. 17 shows an example in which the control unit is duplicated;

FIG. 18 shows an example in which communication paths, communicationequipment, and the control unit are duplicated;

FIG. 19 is a block diagram illustrating one example of a clusterconfiguration of a semiconductor manufacturing apparatus according tothe present invention;

FIG. 20 is a block diagram illustrating one example of a semiconductormanufacturing apparatus interconnected with a service provider and astorage provider; and

FIG. 21 is a block diagram illustrating one example of a semiconductormanufacturing apparatus which can store in-process results.

DESCRIPTION OF PREFERRED EMBODIMENTS

One preferred embodiment of the present invention is shown in FIG. 1.

A calculation unit 10 includes at least one computer which processessemiconductor design information (semiconductor production information)In general, the semiconductor design information is CAD data such asGDSII to be described as pattern information. The semiconductor designinformation also includes cell library information, logic designinformation, and circuit information that are depending upon thesemiconductor process. The calculation unit 10 executes a patterncalculation process and a correction process as well as executes aconversion into a data format that is originated from an electron beamlithography apparatus and that can be inputted by the control unit 20.The control unit 20 inputs the own data format and executes a conversioninto a data that can be inputted by the writing unit 30. The controlunit 20 also executes a correction process against the proximity effectof electron beam radiation, a follow-up control to follow the positionof the stage by which a wafer is moved, and a calibration control forelectron beam radiation. The writing unit 30 inputs data that isoutputted from the control unit 20, and radiates an electron beam(single-beam or multi-beam) based on this data. The storage device 40 isinterconnected with the calculation unit 10, the control unit 20, andthe writing unit 30 through a storage area network 50. The storagedevice 40 stores semiconductor design information and informationproduced by the calculation unit 10, the control unit 20, and thewriting unit 30. A local area network 60 interconnects the calculationunit 10, the control unit 20, and the writing unit 30. A writing datacommunication path 70 is a communication path interconnecting thecontrol unit 20 and the writing unit 30. With such an interconnectionthrough the storage area network 50, it is possible to store informationthat is conventionally disposed at the calculation unit 10, the controlunit 20, and the writing unit 30, and unlike the conventional system, itis not necessary to refer to the storage device 40 via a specificcomputer and the local area network 60. This can alleviate the trafficof the local area network 60. Further, in the conventional system,because the storage device 40 is directly interconnected with a specificcomputer, and in the case of SCSI parallel interface, it is necessary toadd the storage device 40 after the computer is stopped. However,according to the configuration of the present invention, because thestorage device 40 is not directly interconnected to a specific computer,a storage device 40 can be added to the storage area network 50 whennecessary. The storage device 40 indicates a physical storage device, ora virtual storage device or a storage area provided by the physicalstorage device.

FIG. 2 shows a configuration of the present invention in which each ofthe calculation unit 10 and the control unit 20 has at least onecomputer. The calculation unit 10 includes at least one divisioncomputer 100 which executes a process for dividing semiconductorproduction information into arbitrary areas, and at least one conversioncomputer 110 which processes the semiconductor production informationthat is divided into arbitrary areas. The control unit 20 includes atleast one control computer 120. The division computer 100, theconversion computer 110, and the control computer 120 can access thestorage device 40 through the storage area network 50.

FIG. 3 shows an embodiment partly illustrating the calculation unit 10including the division computer 100 and a plurality of conversioncomputers 110, the storage device 40, the storage area network 50, andthe semiconductor production information 200. In this embodiment, thedivision computer 100 and the plurality of conversion computers 111,112, 113, 114 can share the semiconductor production information storedin the storage device 40 through the storage area network 50. In thispreferred embodiment, the conversion computer 110 consists of fourconversion computers 111, 112, 113, 114, however, the number ofconversion computers is not limited to four computers. Because thestorage device 40 is not directly interconnected with the aforementionedcomputers, even if arbitrary numbers of conversion computers are added,they can refer to the storage device 40. This can improve the throughputof the entire apparatus. Further, even if some of the computers causefailure, the other computers can continuously access the storage device40 because the storage device 40 is not directly interconnected with thefaulty computers. Also, it is possible to separate the faulty computersfrom the storage area network 50 without affecting the other computers.

FIG. 4 shows a process flow concerning the embodiment of FIG. 3. Thedivision computer 100 refers to the semiconductor production information200 stored in the storage device 40 and divides it into arbitrary areas(S10). The division computer 100 selects one of the conversion computers111, 112, 113, 114 on condition that it can execute the process (S20).The division computer 100 communicates with the selected conversioncomputer 110 to assign an arbitrary area (S30). After a confirmationwhether or not an unprocessed divided area remains (S50) operation iscompleted if all the areas are processed. If an unprocessed arearemains, then operation returns to S20. If there is no conversioncomputer left which can execute the process, then operation is suspendedto stand by for the arrival of an end message from the conversioncomputers 111, 112, 113, 114 (S40). Meanwhile, the conversion computer111, 112, 113, 114 receives a command for assigning an arbitrary area(S60). Based on the assignment of the area, the conversion computer 110refers to the semiconductor production information 200 stored in thestorage device 40 (S70) Information referred to is then converted (S80).When the process is completed, the conversion computer 110 transmits themessage indicating the end of process to the division computer 100(S90).

FIG. 5 shows one example in which the division computer 100 divides thesemiconductor production information 200 into a plurality of areas 202,204, 206, 208, and stores them in the storage device 40 together withthe semiconductor production information 200. In this preferredembodiment, the conversion computer 110 consists of four conversioncomputers 111, 112, 113, 114, however the number of the conversioncomputers is not limited to four computers. In this embodiment, thedivision computer 100 and the plurality of conversion computers 111,112, 113, 114 can share the semiconductor production information 200stored in the storage device 40 through the storage area network 50.With this configuration, the amount of information stored in the storagedevice 40 increases, however, it is possible to avoid contention ofaccess to the semiconductor production information 200. This can improvethe performance of the entire apparatus.

FIG. 6 shows a process flow concerning the embodiment of FIG. 5.

The division computer 100 refers to the semiconductor productioninformation 200 stored in the storage device 40 and divides it intoarbitrary areas (S110). According to the arbitrary areas, the divisioncomputer 100 divides the semiconductor production information 200 intoplurality pieces of area information 202, 204, 206, 208, and stores themin the storage device 40 (S115). In this preferred embodiment, thesemiconductor production information 200 is divided into four pieces,however, the number of information pieces is not limited. The divisioncomputer 100 selects one of the conversion computers 111, 112, 113, 114on condition that it can execute the process (S120). The divisioncomputer 100 communicates with the selected conversion computer 110 toassign any of the area information 202, 204, 206, 208 (S130). After aconfirmation whether or not an unprocessed divided area remains (S150),operation is completed if all the areas are processed. If an unprocessedarea remains, then operation returns to S120. If there is no conversioncomputer left which can execute the process, then operation is suspendedto stand by for the arrival of an end message from the conversioncomputers 111, 112, 113, 114 (S140). Meanwhile, the conversion computer111, 112, 113, 114 receives a command for assigning arbitrary areainformation (S160). Based on the area information, the conversioncomputer 110 refers to at least one piece of design information 202,204, 206, 208 divided and stored in the storage device 40 (S170).Information referred to is then converted (S180) When the process iscompleted, the conversion computer 110 transmits the message indicatingthe end of process to the division computer 100 (S190).

FIG. 7 shows one example in which the division computer 100 divides thesemiconductor production information 200 into a plurality of areas, andstores them in a storage device 41 that is different from the storagedevice 40 for storing the semiconductor production information 200. Inthis preferred embodiment, the conversion computer 110 consists of fourconversion computers 111, 112, 113, 114, however, the number of theconversion computers is not limited to four computers. In thisembodiment, because the division computer 100 and the plurality ofconversion computers 111, 112, 113, 114 can share the semiconductorproduction information 200 stored in the storage device 40 through thestorage area network 50 and the storage device 41 is further provided,without affecting the process of the conversion computer 110 it ispossible to manipulate the semiconductor production information 200after completing the process of the division computer 100. Such aconfiguration can alleviate a load of the storage device 40 and avoidcontention of access at the storage device 41, which improves theparallel processing performance of the division computer 100 and theconversion computers 111, 112, 113, 114. Further, when the process ofthe division computer 100 is completed, the semiconductor productioninformation 200 is unnecessary and can be deleted. Therefore, it ispossible to store new semiconductor production information 200 in thestorage device 40. Accordingly, the storage device 40 is utilizedeffectively because the semiconductor production information can bedeleted at the time of completing the process of the division computer100 and design information for the next process can be stored in thestorage device 40.

FIG. 8 shows a process flow concerning the embodiment of FIG. 7.

The division computer 100 refers to the semiconductor productioninformation 200 stored in the storage device 40 and divides it intoarbitrary areas (S210). According to the arbitrary areas, the divisioncomputer 100 divides the semiconductor production information 200 intoplurality pieces of area information 202, 204, 206, 208, and stores themin the storage device 40 (S215). In this preferred embodiment, thesemiconductor production information 200 is divided into four pieces,however, the number of information pieces is not limited. The divisioncomputer 100 selects one of the conversion computers 111, 112, 113, 114on condition that it can execute the process (S220). The divisioncomputer 100 communicates with the selected conversion computer 110 toassign any of the area information 202, 204, 206, 208 as well as toassign the storage device 41 (S230). After a confirmation whether or notan unprocessed divided area remains (S250), operation is completed ifall the areas are processed. If an unprocessed area remains, thenoperation returns to S220. If there is no conversion computers leftwhich can execute the process, then operation is suspended to stand byfor the arrival of an end message from the conversion computers 111,112, 113, 114 (S240). Meanwhile, the conversion computer 111, 112, 113,114 receives a command for assigning arbitrary area information (S260).Based on the area information, the conversion computer 110 refers to atleast one piece of design information 202, 204, 206, 208 divided andstored in the storage device 41 (S270). Information referred to is thenconverted (S280). When the process is completed, the conversion computer110 transmits the message indicating the end of process to the divisioncomputer 100 (S290)

FIG. 9 shows one example in which the division computer 100 divides thesemiconductor production information 200 into a plurality of areas 202,204, 206, 208 and stores them in storage devices 42, 44, 46, 48respectively corresponding to the conversion computers 111, 112, 113,114. In this preferred embodiment, the conversion computer 110 consistsof four conversion computers 111, 112, 113, 114, however, the number ofthe conversion computers is not limited to four computers. In thisembodiment, because the division computer 100 and the plurality ofconversion computers 111, 112, 113, 114 can share the semiconductorproduction information 200 stored in the storage device 40 through thestorage area network 50 and the storage devices 42, 44, 46, 48 arefurther provided, it is possible to manipulate the semiconductorproduction information 200 after completing the process of the divisioncomputer 100 without affecting the process of the conversion computer110. Further, because the access of the conversion computers 111, 112,113, 114 to the divided pieces of semiconductor design information 202,204, 206, 208 can be separated, it is possible to improve the accessperformance of the conversion computers 111, 112, 113, 114, whichsubstantially leads to improved conversion process performance.

FIG. 10 shows a process flow concerning the embodiment of FIG. 9. Thedivision computer 100 refers to the semiconductor production information200 stored in the storage device 40 and divides it into arbitrary areas(S310). According to the arbitrary areas, the division computer 100divides the semiconductor production information 200 into pluralitypieces of area information 202, 204, 206, 208, and stores them in thestorage devices 42, 44, 46, 48, respectively (S315). In this preferredembodiment, the semiconductor production information 200 is divided intofour pieces, however, the number of information pieces is not limited.The division computer 100 selects one of the conversion computers 111,112, 113, 114 on condition that it can execute the process (S320). Thedivision computer 100 communicates with the selected conversion computer110 to assign any one of the combinations between the area information202, 204, 206, 208 and the storage device 42, 44, 46, 48 (S330). After aconfirmation whether or not an unprocessed divided area remains (S350),operation is completed if all the areas are processed. If an unprocessedarea remains, then operation returns to S320. If there is no conversioncomputers left which can execute the process, then operation issuspended to stand by for the arrival of an end message from theconversion computers 111, 112, 113, 114 (S340). Meanwhile, theconversion computer 111, 112, 113, 114 receives a command for assigningarbitrary area information and a command for assigning the storagedevice (S360). Based on the assignment of the area information and thestorage device, the conversion computer 110 refers to at least one pieceof design information 202, 204, 206, 208 divided and respectively storedin the storage devices 42, 44, 46, 48 (S370). Information referred to isthen converted (S380). When the process is completed, the conversioncomputer 110 transmits the message indicating the end of the process tothe division computer 100 (S390).

FIG. 11 shows an example in which the semiconductor productioninformation 200 stored in the storage device 40 is divided intostrip-shaped pieces. Strip-shaped stripe information 302 to 350 isdetermined such that the divided width in X-axis has an area width whichallows electron beam radiation, such as of several hundreds micrometers,and the length in Y-axis has a range which allows movement of the stage,such as of several hundreds millimeters. Accordingly, the stripeinformation becomes appropriate for radiation of an electron beam withthe stage continuously moved. This can improve the access efficiency foraccessing the stripe information.

FIG. 12 shows an example in which the semiconductor productioninformation 200 stored in the storage device 40 is divided intomesh-shaped pieces. Mesh-shaped divided information 402 to 450 has afixed value of 1 mm for both width and height. Because the size of onedivided piece of design information becomes smaller when compared withthe strip-shaped piece shown in FIG. 11, it is possible to alleviate theprocess load of the conversion computer 110. Further, with decreasednumber of divisions in Y-axis, semiconductor parts stored in thesemiconductor production information 200 are less likely to be divided.This can improve the accuracy of the entire electron beam lithography.

FIG. 13 shows one example of stripe writing information 520, wherein thedivided semiconductor production information 200 shown in FIG. 11 orFIG. 12 is processed by the conversion computer 110 and the results arestored in order of logic address of the storage device 80 as finewriting information 510 which consists of a pair of area information 501and pattern information 502 presented in the area that is shown by thearea information 501, such that the fine writing information 510 enableselectron beam radiation to be effectively executed along its radiationlocus. The logic address corresponds, for example, to LBA (Logical BlockAddress) of SCSI disk drive. The stripe writing information 520 isassociated with the respective areas 302 to 350 of FIG. 11 each dividedin strip-shape. Also, the stripe writing information 520 is associatedwith an arbitrary pair of divided mesh-shaped areas 402 to 450 shown inFIG. 12, that is, for example, divided areas 402, 404, 406, 408, 410combined in the Y-axis direction.

As described above, because the area information 501 and the patterninformation 502 presented in the area shown by the area information 501are continuously stored in order of logic address of the storage device80, performance of the storage device will be improved due to continuousreadout. Further, the writing performance will be improved in terms ofstep and repeat method such that the stage is moved per fine writinginformation 510 to execute the writing.

FIG. 14 shows one example in which the divided semiconductor productioninformation 200 shown in FIG. 11 or FIG. 12 is processed by theconversion computer 110 and the results are stored in order of logicaddress of the storage device 80 as area group information 530 and apattern information group 540. The area group information 530 isarranged in order such that area information 501 enables electron beamradiation to be effectively executed along the radiation locus. Thepattern information group 540 is arranged such that the patterninformation 502 presented in the area that is shown by the areainformation 501 is put in order in a manner corresponding to thearrangement of the area group information 530. The stripe writinginformation 520 is associated with the respective areas 302 to 350 eachdivided in strip-shaped. Also, the stripe writing information 520 isassociated with an arbitrary pair of divided mesh-shaped areas 402 to450 shown in FIG. 12, that is, for example, divided areas 402, 404, 406,408, 410 combined in the Y-axis direction.

As described above, because the area information 501 and the patterninformation 502 presented in the area shown by the area information 501are continuously stored in order of logic address of the storage device80, readout performance of the storage device will be improved due tocontinuous readout. Further, because the area group information 530 isread out prior to the pattern information group 540, the traveling speedof the stage can be optimized. Therefore, it is possible to improve thecontinuous writing performance for continuously moving the stage andcontinuously deflecting the electron beam lithography.

FIG. 15 shows a semiconductor manufacturing apparatus in which thestorage area network 50 employs a topology using a switch 51. Thecalculation unit 10 includes at lease one division computer 100 whichexecutes a process for dividing the semiconductor production informationinto arbitrary areas, and at least one conversion computer 110 whichprocesses the semiconductor production information that is divided intoarbitrary areas. The control unit 20 includes at least one controlcomputer 120.

The storage device 40 for storing the semiconductor productioninformation 200 is interconnected with a switch 51 through acommunication pass 1000, and the storage device 80 for storing thestripe writing information group 500 is interconnected with the switch51 through a communication pass 1010. The division computer 100, theconversion computer 110, and the control computer 120 are interconnectedwith the switch 51, respectively through a communication pass 1020, acommunication pass 1030, and a communication pass 1040. The storage areanetwork 50 is configured accordingly.

FIG. 16 shows a semiconductor manufacturing apparatus in which thestorage area network 50 employs a topology using switches andcommunication passes are duplicated for the purposes of expanding thecommunication band and avoiding failure. The calculation unit 10includes at least one division computer 100 which executes a process fordividing the semiconductor production information into arbitrary areas,and at least one conversion computer 110 which processes thesemiconductor production information that is divided into arbitraryareas. The control unit 20 includes at least one control computer 120.

The storage device 40 for storing the semiconductor productioninformation 200 is interconnected with switches 51, 52 throughcommunication passes 1000, 1050, and the storage device 80 for storingthe stripe writing information group 500 is interconnected with theswitches 51, 52 through communication passes 1010, 1060. The divisioncomputer 100, the conversion computer 110, and the control computer 120are interconnected with the switches 51, 52, respectively throughcommunication passes 1020, 1070, communication passes 1030, 1080, andcommunication passes 1040, 1090. The storage area network 50 duplicatedand having redundancy is configured accordingly.

FIG. 17 shows an example in which the control unit 20 is duplicated atthe control computers 120, 121 so as to access the aggregate of thestripe writing information of FIGS. 11 and 12 stored in the storagedevice 80. With this configuration, the control unit 20 does not have towait the processing time of the writing unit 30. The calculation unit 10includes at least one division computer 100 which execute a process fordividing the semiconductor production information into arbitrary areas,and at least one conversion computer 110 which processes thesemiconductor production information that is divided into arbitraryareas. The control unit 20 includes control computers 120, 121. Thestorage device 40 for storing the semiconductor production information200 is interconnected with a switch 51 through a communication pass1000, and the storage device 80 for storing the stripe writinginformation 500 is interconnected with the switch 51 through acommunication pass 1010. The division computer 100, the conversioncomputer 110, the control computer 120, and the control computer 121 areinterconnected with the switch 51, respectively through a communicationpass 1020, a communication pass 1030, a communication pass 1040, and acommunication pass 1100. The storage area network 50 is configuredaccordingly. The control computer 120 accesses the storage device 80through the communication pass 1040, the switch 51, and thecommunication pass 1010, and then processes writing information that isassociated with one stripe of the stripe writing information group 500stored in the storage device 80. The processing result is transferred tothe writing unit 30 through the communication pass 70 to performwriting. During the time the control computer 120 executes theprocessing and the writing unit 30 executes electron beam lithography,the control computer 121 can process writing information associated withthe next stripe. Similar to the control computer 120, the controlcomputer 121 accesses the storage device 80 through the communicationpass 1100, the switch 51, and the communication pass 1010, and thenprocesses unprocessed stripe writing information group 500 stored in thestorage device 80. As describe above, the control computer 120 and thecontrol computer 121 alternately execute the process in advance of theother, which improves the performance of the entire apparatus.

FIG. 18 shows an example in which the storage devices are duplicated forthe purposes of avoiding contention of access at the storage device 80shown in FIGS. 16 and 17 and improving the throughput. The calculationunit 10 includes at least one division computer 100 which executes aprocess for dividing the semiconductor production information intoarbitrary areas, and at least one conversion computer 110 whichprocesses the semiconductor production information that is divided intoarbitrary areas. The control unit 20 includes two control computers 120,121. The storage device 40 for storing the semiconductor productioninformation 200 is interconnected with switches 51, 52 troughcommunication passes 1000, 1050. The storage device 80 for storing thestripe writing information group 500 is interconnected with the switches51, 52 through communication passes 1010, 1060. The storage device 81for storing the stripe processing results 501 is interconnected with theswitches 51, 52 through communication passes 1011, 1061. The divisioncomputer 100, the conversion computer 110, the control computer 120, andthe control computer 121 are interconnected with the switches 51, 52,respectively through communication passes 1020, 1070, communicationpasses 1030, 1080, communication passes 1040, 1090, and a communicationpass 1090. The storage area network 50 duplicated and having redundancyis configured accordingly.

For example, in a case where the storage device 80 is associated withthe control computer 120 and the storage device 81 is associated withthe control computer 121, the conversion computer 110 stores theprocessing results in the storage device 80 through the communicationpass 1080, the switch 51, and the communication pass 1010, while thecontrol computer 120 can read out the stripe processing results 500 fromthe storage device 80 through the communication pass 1040, the switch52, and the communication pass 1060. Also, the conversion computer 110stores the processing results in the storage device 81 through thecommunication pass 1030, the switch 52, and the communication pass 1061,while the control computer 121 can read out the stripe processingresults 501 from the storage device 81 through the communication pass1090, the switch 51, and the communication pass 1011.

As described above, the storage operation of the conversion computer 110to the storage device 80, the access of the control computer 120 to thestorage device 80, the storage operation of the conversion computer 110to the storage device 81, and the access of the control computer 121 tothe storage device 81 can be performed through different accesspassages. Therefore, the contention of access at the storage devices 80,81 and the control computers 120, 121 can be avoided, and theperformance of the entire system can be improved.

FIG. 19 shows an example in which a configuration downstream of thestorage device 80 is multiplexed. The storage device 80 for storing thestripe writing information group 500 is interconnected with the storagearea network 50. The control unit includes at least one computer 120,and is interconnected with the writing unit 30 through a communicationpass 70. The control unit 21 includes at least one computer 130, and isinterconnected with the writing unit 31 through a communication pass 71.The control unit 20, the writing unit 30, the control unit 21, and thewriting unit 31 are interconnected with the storage area network 50,through which they can access the stripe writing information group 500.With this configuration, plurality combinations of the control unit andthe writing unit are interconnected with the storage area network 50,which leads to decreased writing time with respect to the same stripewriting information group 500. With the combination of a multiplexedsystem as shown in FIG. 18 in which computers corresponding to thestorage device 81 and the control computer 121 are added, speeding up ofthe processing and decreased writing time can be achieved.

FIG. 20 shows a configuration in which the division computer 100 and theconversion computer 110 of the calculation unit 10 are computers of aservice provider 600 whose business is to offer lease and management ofcomputers, and the storage device 40 for storing the semiconductorproduction information and the storage devices 80, 81 for storing thestripe writing information are storage devices of a storage provider 700whose business is to offer lease and management of storage devices, andin which the division computer 100, the conversion computer 110, and thestorage devices 40, 80, 81 are interconnected with the control unit 20and the writing unit 30 through a plurality of passages, such as theInternet 62 or communication pass 32 such as an exclusive line, via arouter or bridge 64. The storage device 81 is for backing up the storagedevice 80, and is also used for storing local copies of the storagedevice 80 and the storage device 40 that is provided in case thecommunication band of the communication pass 32 is narrow, andfrequently-used information. With this configuration, only the controlunit 20 and the writing unit 30 of the semiconductor manufacturingapparatus can be installed in a semiconductor manufacturing site.Therefore, it is possible to decrease the install space within the cleanroom. A semiconductor manufacturing apparatus user 2000 as a client ofthe apparatus or a client 2000 of the semiconductor manufacturingapparatus user accesses the Internet 62 or the storage area network 50,so that they can use the computers of the service provider 600, thestorage devices of the storage provider 700, the control unit 20, andthe writing unit 30. In a case where the client 2000 is a logic designmaker, mask layout data as a kind of semiconductor design data can beshared through the storage area network 50, 32 or the Internet 62, whichallows unify management and unify storage of the mask layout data.Unlike the conventional configuration, it does not requiretime-consuming transmission/reception of the semiconductor productioninformation 200 between the client and the apparatus user, and they donot have to possess a storage device with a storage capacitycorresponding to the semiconductor production information 200.

Because the semiconductor manufacturing apparatus substantially consistof the control unit 20 and the writing unit 30, by utilizing facilitiesof the service provider 600 and the storage provider 700, it is possibleto improve the operating efficiency of the facilities with smallinvestment.

FIG. 21 shows an example in which the storage device stores shotinformation concerning electron beam radiation. The calculation unit 10includes at least one division computer 100 and at least one conversioncomputer 110, and is interconnected with the storage area network 50 andthe local area network 60. The control unit 20 includes at least onecontrol computer 120, a division unit 125 which divides patterninformation included in the stripe writing information into basicpatterns to be written by electron beam, a proximity correction unit 126which executes a proximity effect correction on the electron beamradiation, a calibration unit 140 which calibrates the position of theelectron beam radiation and the like, and a follow-up unit 142 whichfollows up the movement of the stage 32 and exerts an influence ondeflection of electron beam radiation. The control unit 20 isinterconnected with the storage area network 50 and the local areanetwork 60. The writing unit 30 includes DAC 31 which converts digitaldata transmitted through the writing data communication pass 70 intoanalog data and controls a beam deflector and the like, the stage 32 formoving a mask or a wafer, and a bridge 33 which converts digital data tobe inputted into DAC 31 into protocol of the storage area network 50.The writing unit 30 is interconnected with the storage area network 50and the local area network 60.

With this configuration, processing results at the division unit 125,the proximity correction unit 126, and the calibration unit 140 can betemporally stored in the storage device 40. This can allow the suspendedprocess to be restarted based on the temporally stored results. Further,the shot information 210 for electron beam radiation is stored in thestorage device 40 through the bridge 33. This allows an evaluation ofthe shot without actual writing even if DAC 31 is not operated, and whenthe writing is performed actually, it can help to investigate a cause oftrouble at the time of writing the shot information 210 stored in thestorage device 40.

As previously described with reference to various embodiments, thepresent invention provides a semiconductor manufacturing apparatus,which executes communication of a large volume of semiconductor designinformation (semiconductor production information) at high speed, andwhich stores the design information, and which further includes anetwork through which a plurality of devices can refer to the designinformation.

Also, the present invention provides a semiconductor manufacturingapparatus, which includes means for storing processing results afterconverting and correcting the semiconductor design information, andwhich allows to suspend and restart the writing process with the use ofthe stored processing results.

Further, the present invention provides a semiconductor manufacturingapparatus, which permits a storage format and arrangement of storagedevices suitable for the method and the locus of electron beam radiationwith respect to the movement of the stage and electron beam radiationpermissible area.

Further, the present invention provides a semiconductor manufacturingapparatus, which allows computers and/or storage devices to be addedand/or removed according to a requirement about processing performanceand storage capacity without stopping the semiconductor manufacturingapparatus.

According to the present invention, with the provision of acommunication pass for interconnecting a storage device, it is possibleto improve the throughput of the entire apparatus and to unify themanagement of various data.

1. A semiconductor manufacturing apparatus comprising: a calculationunit including at least one computer for processing semiconductor designinformation; a control unit for controlling radiation of an electron inaccordance with a processing result of the semiconductor designinformation; a writing unit for radiating an electron in accordance withinstructions of the control unit; and at least one storage device,wherein a communication is permissible between the storage device, thecalculation unit, the control unit, and the writing unit, and whereinthe semiconductor manufacturing apparatus further includes acommunication pass through which the storage device can be controlled.2-15. (canceled)